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Mechanical Engineer/Electronics Packaging

The Particle Physics and Astrophysics Directorate at the SLAC National Accelerator Laboratory is looking for a Mechanical Engineer with a background in electronics packaging to design key components in next generation science detector and data acquisition systems for several SLAC high-energy physics and photon science experiments. The successful candidate will work mainly in two areas:
  • Design and analyze detector and camera assemblies with pixel-sensors, electronic chip components, printed circuit boards, Peltier devices for in and out-vacuum applications.  Managing the fabrication and assembly is part of the positions.
  • For the Cryogenic Dark Matter Search (CDMS), the team aims to deploy 100kg of pure Germanium (Ge) crystals cooled to a temperature of 0.05 Kelvin to detect the as yet undiscovered Dark Matter that accounts for 85% of the mass of the universe.  The successful applicant will work with engineers and physicists from SLAC and other institutions to develop the mechanical design of the Ge Tower System that provides mechanical support for the crystals, thermal isolation of the crystals between 0.05K and 4K, and the electromechanical interface necessary to support the low temperature wiring and electronics.  This part of the position involves working closely with SLAC physicists to develop conceptual designs for the Ge Tower mechanics, creating detailed solid models for the Ge Tower components, analyzing thermal performance of the Ge Tower, working with SLAC and/or outside shops to fabricate a complete Ge Tower assembly, and assist in the mechanical and thermal testing of the Ge Tower.
  
Qualifications:• BS or MS in Mechanical Engineering or related field
• Demonstrated extensive experience in system-level mechanical design
• Demonstrated “hands-on” ability in designing and fabricating complex mechanical assemblies
• Demonstrated knowledge of mechanical design principles, material selection, vacuum technologies, thermal management systems, electronic packaging (system, chassis, and chip level)
• Ability to derive design requirements from end item requirements.
• Proficient in NX, Solid Edge or SolidWorks
• Strong thermal design experience.
• Recent experience with thermal and structural analysis tools--SINDA and ANSYS Workbench preferred.
• Experience in the packaging of high density electronics systems intended to be used in severe thermal environments.
• Knowledge of materials and processes relevant to electronics.
• Familiarity with printed circuit board design, construction and assembly.
• Excellent written and verbal communication skills
• Demonstrated ability to work with deadlines/schedules and successfully complete projects
• Demonstrated ability to independently conduct efforts requiring judgment, evaluation, selection, and adaptation of standard and nonstandard engineering techniques.
• Demonstrated ability and experience to manage several new designs concurrently as well as support of proposals and research and development activities.
Desired Skills:• Experience in ultra low-temperature (millikelvin) mechanical design.

Please Note:  The SLAC National Accelerator Laboratory values diversity and is an affirmative action, equal opportunity employer. SLAC confirms employment authorization for all new hires through the E-Verify Program.

Mechanical Engineer/Electronics Packaging